BOE Cleaning Equipment
Product Name: BOE Cleaning Equipment
Function: Used for the removal of PSG and silicon oxide in PVD processes.
Process Flow: Pickling→Rinse→Pre-dehydration→Drying
Features: Supports MES, RFID, and optional online weighing functions; one-key online washing and solution replacement for simple and quick fluid exchange; process tank circulation volume adjustable according to process requirements; compatible with additives from various brands; thorough removal of deposition and thorough cleaning.
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Product Name |
BOE Cleaning Equipment |
|
Model |
KSBOE |
|
Route Application |
TOPCON |
|
Function |
Used for the removal of PSG and silicon oxide in PVD processes. |
|
Process Flow |
Pickling→Rinse→Pre-dehydration→Drying |
|
Compatible Wafer |
182x182mm, compatible with various sizes of 18X 230 silicon wafers. |
|
Cassette Number |
4, 6 cassettes |
|
Capacity |
182: ≥16000 pcs/hour; 210: ≥12500 pcs/hour |
|
Breakage Rate |
Breakage rate <0.01% (Silicon wafer thickness ≥130um) |
|
Power Consumption/ Voltage |
295KW/380V 50Hz 3-phase 5-wire system |
|
Features |
Supports MES, RFID, and optional online weighing functions; one-key online washing and solution replacement for simple and quick fluid exchange; process tank circulation volume adjustable according to process requirements; compatible with additives from various brands; thorough removal of deposition and thorough cleaning. |