Inline Acid Etching Cleaning Equipment
Product Name: Inline Acid Etching Cleaning Equipment
Function: Used for the polishing and cleaning treatment of silicon wafer surfaces.
Process Flow: Water Film→Etching→Rinse→Alkali Washing→Rinse→Pickling→Rinse→Drying
Features: High-speed precision liquid-carrying etching roller to avoid under-etching or over-etching at the edges; refined water film control to ensure complete coverage without dripping; real-time monitoring of solution conductivity to ensure etching process stability; stable production at 3.5m/min, less friction, longer consumable life.
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Product Name |
Inline Acid Etching Cleaning Equipment |
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Model |
KSKSQXJ |
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Route Application |
PERC |
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Function |
Used for the polishing and cleaning treatment of silicon wafer surfaces. |
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Process Flow |
Water Film→Etching→Rinse→Alkali Washing→Rinse→Pickling→Rinse→Drying |
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Compatible Wafer |
182x182mm, compatible with various sizes of 18X230 silicon wafers |
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Lane Number |
5 |
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Operation Speed |
1.0-4.0m/min |
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Breakage Rate |
Breakage rate <0.01% (Silicon wafer thickness ≥130um) |
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Power Consumption/ Voltage |
30KW/380V 50Hz 3-phase 5-wire system |
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Features |
High-speed precision liquid-carrying etching roller to avoid under-etching or over-etching at the edges; refined water film control to ensure complete coverage without dripping; real-time monitoring of solution conductivity to ensure etching process stability; stable production at 3.5m/min, less friction, longer consumable life. |