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Product Name:Inline-type (Horizontal) Electroplating
Model: KS-I-Plating-001
Route Application: Electroplating for HJT, TOPCon, and XBC solar cells
Function: Compatible with single-side and double-side electroplating for various cell types; supports nickel, copper, and tin plating according to process requirements
Process Flow: Degreasing, rinsing, (activation), plating, rinsing, drying
Compatible Wafer: Compatible with various wafer sizes such as 210×105 mm, 182×182 mm, 210×182 mm, etc.
Cassette Number: ——
Capacity: 14,400+ pcs/hour
Breakage Rate: Wafer thickness ≥130 μm, breakage rate <0.01%
Power Consumption/ Voltage: 180KW、380V
Features: Compatible with both single-side and double-side electroplating; no complex automation required; good uniformity; no de-plating required; especially suitable for single-side plating and busbar/gridline plating

Product Name:Inline-type (Horizontal) Electroplating
Model: KS-I-Plating-001
Route Application: Electroplating for HJT, TOPCon, and XBC solar cells
Function: Compatible with single-side and double-side electroplating for various cell types; supports nickel, copper, and tin plating according to process requirements
Process Flow: Degreasing, rinsing, (activation), plating, rinsing, drying
Compatible Wafer: Compatible with various wafer sizes such as 210×105 mm, 182×182 mm, 210×182 mm, etc.
Cassette Number: ——
Capacity: 14,400+ pcs/hour
Breakage Rate: Wafer thickness ≥130 μm, breakage rate <0.01%
Power Consumption/ Voltage: 180KW、380V
Features: Compatible with both single-side and double-side electroplating; no complex automation required; good uniformity; no de-plating required; especially suitable for single-side plating and busbar/gridline plating