Post-cleaning Equipment
Product: NamePost-cleaning Equipment
Model: KS-postcleaning-001
Route Application: Post-metallization mask removal + etching process / electroless plating or anti-oxidation protection layer
Function: "Mask removal: highly selective stripping without damaging the plated layer; multi-stage rinsing ensures no residue
Etching: removal of underlying copper"
Process Flow: Mask removal, rinsing, etching, immersion tin plating, rinsing, drying
Compatible Wafer: Compatible with various wafer sizes such as 210×105 mm, 182×182 mm, 210×182 mm, etc.
Cassette Number: 4, 6 cassettes
Capacity: 14,400+ pcs/hour
Breakage Rate:: Wafer thickness ≥130 μm, breakage rate <0.01%
Power Consumption/ Voltage: 260KW、380V
Features: Fully automated line integration; multi-process all-in-one system; chemical recycling and regeneration; cost-effective and environmentally friendly
Product: NamePost-cleaning Equipment
Model: KS-postcleaning-001
Route Application: Post-metallization mask removal + etching process / electroless plating or anti-oxidation protection layer
Function: "Mask removal: highly selective stripping without damaging the plated layer; multi-stage rinsing ensures no residue
Etching: removal of underlying copper"
Process Flow: Mask removal, rinsing, etching, immersion tin plating, rinsing, drying
Compatible Wafer: Compatible with various wafer sizes such as 210×105 mm, 182×182 mm, 210×182 mm, etc.
Cassette Number: 4, 6 cassettes
Capacity: 14,400+ pcs/hour
Breakage Rate:: Wafer thickness ≥130 μm, breakage rate <0.01%
Power Consumption/ Voltage: 260KW、380V
Features: Fully automated line integration; multi-process all-in-one system; chemical recycling and regeneration; cost-effective and environmentally friendly